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    TechTrends

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    IDTechEx Explores Advanced Semiconductor Packaging Technologies: 2.5D and 3D Insights
    BOSTON, Jan. 10, 2024 /-- Semiconductor packaging technologies have evolved from initial 1D PCB levels to cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency. Four critical parameters shape advanced semiconductor packaging: power, performance, area, and cost: Power: Enhancing […]
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    How is Artificial Intelligence Changing Work?
    Timely Insights from NEI Global Relocation on the Future of Work and the Business Impact of AI "It's hard to overstate what "work" means to humanity—it's an integral part of what we do. A defining characteristic. From chariots to cathedrals, currency, jet planes, and colliders, our hunger for innovation is plain as day. But will […]
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    First 5G-ACIA General Assembly in Taiwan to Unlock Global 5G Market
    HSINCHU, Dec. 29, 2023  -- The 5G Alliance for Connected Industries and Automation (5G-ACIA), the world's largest 5G industrial alliance, held its annual General Assembly in Taiwan for the first time, drawing participation from industry heavyweights such as Bosch, Ericsson, Mitsubishi Electric, Nokia, Qualcomm, and Siemens. The Industrial Technology Research Institute (ITRI) facilitated the signing […]
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